| FY2001 |
* Selected lead-free cream solder and flux |
Lead-Free
Preparation period of production |
| * Researched the heat proofing of automation parts |
| * Evaluated wettability for plate materials of electronic parts and flow
parts |
* Researched durability of flow machine
* Evaluated solder of hand solder process
* Researched sub-standard contact parts of electronic lead-free solder
checking machines |
| * Researched of reliability and quality of lead-free circuit boards |
* Started production using lead-free reflow machines at China consignment
factory
* Appearance check of reflow and flow process / Comparison to earlier machine
fixing |
Early stage of starting up period
Chinese factory started production |
| * Installed lead-free flow box at China consignment factory |
| FY2002 |
* Installed lead-free reflow machines at Shima factory
 |
Mass production starting period
Japanese factory started production |
* Installed lead-free flow box at Ise factory
* Started the production of lead-free processing for other machines at
China consignment factory |
All factories in
Started production |
* Installed lead-free reflow machines at China consignment factory
* Installed lead-free reflow machines at SHIMA Malaysia |
| * Installed lead-free flow box at Shima factory |
  |
* Shima factory began lead-free processing for various machines.
* Shima factory began lead-free processing for double-sided reflow machines. |
| FY2004 |
* PB-free production accounts for 85% of total production
( Percentege of PB free production = Japan: 70% China consignment factory: 90% Malaysia: 95% ) |
| FY2005 |
* Started evaluation of nitrogen reflow and dip box |
